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Nozzle-line type
  • Nozzle-line type
  • Nozzle-line type
  • Nozzle-line type
  • Nozzle-line type
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Nozzle-line type

This point type, nozzle type megasonic cleaner is mainly used for cleaning wafers and hard disks. Megasonic waves are applied to the stream of water from the nozzle tip, to ensure effective cleaning. The emitted stream of water works in conjunction with the propagated ultrasonic waves to remove the contamination from the item that is cleaned, and it also functions as a transport medium to carry the contamination away. As is characteristic of nozzle type cleaners, this model prevents particles from reattaching to the cleaned object, and it is effective for removing submicron contamination. A wide selection of variations are available to suit your applications and cleaning liquids.

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  • Megasonic Cleaning Systems

    Line type




    Megasonic Cleaning Systems line type


    YMMS


    ● Smaller and lighter than traditional models;

    ● Applying ultrasonic pressure to the stream from the nozzle will accelerate particles in the water, which will remove submicron contamination from the objective lens;

    ● Fresh deionized water supply avoids re-contamination in the cleaning medium;

    ● Cleaning water in the form of a single line supply, can effectively clean liquid crystal glass and other wide materials;

    ● High frequency ultrasonic wave (megabound) is effective for fine particle pollution;

    ● Output power control adjustable power, suitable for magnetic head and other precision objects;



    Characteristics

    Megasonic Cleaning Systems does not produce strong cavitation effect, which can avoid damage to the surface of the cleaning object and residual pollutants in the cleaning process. Megabound cleaning efficiency is high, time is short, the use of cleaning agent concentration is low, the consumption of chemical reagents is less, so the level of harm to the environment is low.



      Method of application  

    ● Cleaning after mirror polishing or before vapor deposition GaAs wafers;

    ● LCD glass, HDD media or silicon wafer cleaning;

    ● Used for cleaning after CMP processing;



      Device Features  

    • Traffic: 8 l - 60 l/min;

    • Nozzle slit size: 95mm-600mm;

    • Effective cleaning area: 80mm-580mm;

    • Smaller and lighter than traditional models

    • Applying acoustic pressure to the stream from the nozzle accelerates particles in the water that move to remove submicron contamination from the objective;

    • Fresh deionized water supply avoids re-contamination in the cleaning medium;

    • Cleaning water in the form of a single line supply, can effectively clean liquid crystal glass and other wide materials;

    • High frequency megabytes are effective against fine particle pollution;

    • Output power control adjustable power, suitable for magnetic head and other precision objects;

    • Suitable for line production type online cleaning processing;

    International Certification








    Megasonic Cleaning Systems

    Line type




    Megasonic Cleaning Systems line type


    YMMS


    ● Smaller and lighter than traditional models;

    ● Applying ultrasonic pressure to the stream from the nozzle will accelerate particles in the water, which will remove submicron contamination from the objective lens;

    ● Fresh deionized water supply avoids re-contamination in the cleaning medium;

    ● Cleaning water in the form of a single line supply, can effectively clean liquid crystal glass and other wide materials;

    ● High frequency ultrasonic wave (megabound) is effective for fine particle pollution;

    ● Output power control adjustable power, suitable for magnetic head and other precision objects;



    Characteristics

    Megasonic Cleaning Systems does not produce strong cavitation effect, which can avoid damage to the surface of the cleaning object and residual pollutants in the cleaning process. Megabound cleaning efficiency is high, time is short, the use of cleaning agent concentration is low, the consumption of chemical reagents is less, so the level of harm to the environment is low.



      Method of application  

    ● Cleaning after mirror polishing or before vapor deposition GaAs wafers;

    ● LCD glass, HDD media or silicon wafer cleaning;

    ● Used for cleaning after CMP processing;



      Device Features  

    • Traffic: 8 l - 60 l/min;

    • Nozzle slit size: 95mm-600mm;

    • Effective cleaning area: 80mm-580mm;

    • Smaller and lighter than traditional models

    • Applying acoustic pressure to the stream from the nozzle accelerates particles in the water that move to remove submicron contamination from the objective;

    • Fresh deionized water supply avoids re-contamination in the cleaning medium;

    • Cleaning water in the form of a single line supply, can effectively clean liquid crystal glass and other wide materials;

    • High frequency megabytes are effective against fine particle pollution;

    • Output power control adjustable power, suitable for magnetic head and other precision objects;

    • Suitable for line production type online cleaning processing;

    International Certification



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