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1.Megasonic cleaning
The mechanism of Megasonic cleaning is that the silicon wafer is cleaned by the high energy frequency vibration effect combined with the chemical reaction of cleaning agent. In the cleaning process, the transducer sends out high-energy sound wave with the wavelength of megahertz, and the solution molecules accelerate their movement under the push of the sound wave. The maximum instantaneous speed can reach 30cm/s. Due to the high frequency, cavitation bubbles like ultrasonic cleaning cannot be formed, but only the high-speed hydrodynamics layer generated by strong sound pressure gradient and sound flow can continuously impact the surface of the substrate. The particles that attach the substrate surface are forced off and into the medium solution. Megatonic wave cleaning not only preserves the advantages of ultrasonic cleaning, but also overcomes its shortcomings. Megatonic wave cleaning can remove particles less than 0.1llxm on the surface of the substrate, playing a role that ultrasonic can not play. This method can simultaneously play the role of mechanical cleaning (torsion) and chemical cleaning. In addition, mega acoustic wave cleaning frequency is higher, it is different from the ultrasonic cleaning of standing wave, will not damage the cleaning object. In addition, megatonic wave has more advantages than ultrasonic wave in viscous layer thickness, power density, resonance effect and diffraction effect.
2. Strong independent development and design team
3. Rich application cases
4. industrial application accessories optimization and upgrade development, strong versatility
5. the basic original materials import custom design, production integration
6. more than 40 processing technology to ensure the service life
7. Strong ability of non-standard customization
8. Fast response speed to avoid delay of production line
9. Application Scope:
Various specifications of Megasonic cleaning system (such as: Megasonic cleaning nozzle, communication cable, control cable, power supply, tool head) super accessories loss parts, as well as the upgrade and optimization of line standard products.
1.Megasonic cleaning
The mechanism of Megasonic cleaning is that the silicon wafer is cleaned by the high energy frequency vibration effect combined with the chemical reaction of cleaning agent. In the cleaning process, the transducer sends out high-energy sound wave with the wavelength of megahertz, and the solution molecules accelerate their movement under the push of the sound wave. The maximum instantaneous speed can reach 30cm/s. Due to the high frequency, cavitation bubbles like ultrasonic cleaning cannot be formed, but only the high-speed hydrodynamics layer generated by strong sound pressure gradient and sound flow can continuously impact the surface of the substrate. The particles that attach the substrate surface are forced off and into the medium solution. Megatonic wave cleaning not only preserves the advantages of ultrasonic cleaning, but also overcomes its shortcomings. Megatonic wave cleaning can remove particles less than 0.1llxm on the surface of the substrate, playing a role that ultrasonic can not play. This method can simultaneously play the role of mechanical cleaning (torsion) and chemical cleaning. In addition, mega acoustic wave cleaning frequency is higher, it is different from the ultrasonic cleaning of standing wave, will not damage the cleaning object. In addition, megatonic wave has more advantages than ultrasonic wave in viscous layer thickness, power density, resonance effect and diffraction effect.
2. Strong independent development and design team
3. Rich application cases
4. industrial application accessories optimization and upgrade development, strong versatility
5. the basic original materials import custom design, production integration
6. more than 40 processing technology to ensure the service life
7. Strong ability of non-standard customization
8. Fast response speed to avoid delay of production line
9. Application Scope:
Various specifications of Megasonic cleaning system (such as: Megasonic cleaning nozzle, communication cable, control cable, power supply, tool head) super accessories loss parts, as well as the upgrade and optimization of line standard products.
