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YMJH-1000
  • YMJH-1000
  • YMJH-1000
0 1

YMJH-1000

Wafer Bonding refers to a technology that connects wafers and other devices into a new wafer through a physical method. It is a very important technology in modern semiconductor manufacturing technology, widely used in MEMS devices, solar cells, LED wafers and other fields.

  • Product Details
  • Accessory consumables
  • Attachment Download


  • Wafer Bonding Machine - Modular wafer bonding system


    Wafer Bonding Technology refers to the close combination of two homogeneous or heterogeneous chips that have been mirror-polished through chemical and physical action. After wafer bonding, the atoms on the interface react under the action of external forces to form covalent bonds and combine into a whole, and make the bonding interface reach specific bonding strength.


      Equipment characteristics  

    ● Modular configuration

    ● Automatic process cycle

    ● Handle 2-8 inch products

    ● Ultra-high wafers support disc parallelism

    ● Low/medium yield is used in production tools

    ● Industry-standard safety features

    ● Multi-functional scheme creation and automation mode

    ● Data collection and export

    ● Touch screen user interface




      Advantages and characteristics  

    ● High precision: The wafer bonding machine has a high precision, the diameter and thickness of each bonded wafer can reach the precise standard;

    ● High reliability: The key components of wafer bonding machine are all international first-class products, to ensure the high reliability of the equipment;

    ● High speed: The wafer bonding machine works fast and can process a large number of wafers in a short time;

    ● High automation: automatic control system can eliminate manual manipulation, greatly improve the work efficiency;



      Technical parameter  

    Chamber size≤12 inches downward compatible
    Temperature range≤300℃
    Cycle time0-60min adjustable
    Power supply220V





    Wafer Bonding Machine - Modular wafer bonding system


    Wafer Bonding Technology refers to the close combination of two homogeneous or heterogeneous chips that have been mirror-polished through chemical and physical action. After wafer bonding, the atoms on the interface react under the action of external forces to form covalent bonds and combine into a whole, and make the bonding interface reach specific bonding strength.


      Equipment characteristics  

    ● Modular configuration

    ● Automatic process cycle

    ● Handle 2-8 inch products

    ● Ultra-high wafers support disc parallelism

    ● Low/medium yield is used in production tools

    ● Industry-standard safety features

    ● Multi-functional scheme creation and automation mode

    ● Data collection and export

    ● Touch screen user interface




      Advantages and characteristics  

    ● High precision: The wafer bonding machine has a high precision, the diameter and thickness of each bonded wafer can reach the precise standard;

    ● High reliability: The key components of wafer bonding machine are all international first-class products, to ensure the high reliability of the equipment;

    ● High speed: The wafer bonding machine works fast and can process a large number of wafers in a short time;

    ● High automation: automatic control system can eliminate manual manipulation, greatly improve the work efficiency;



      Technical parameter  

    Chamber size≤12 inches downward compatible
    Temperature range≤300℃
    Cycle time0-60min adjustable
    Power supply220V



  • Heat transfer


    Heat Transfer is a cooling oil used in YMJH systems;


    Mounting adhesive


    A range of sealers used to bond semiconductor, optical and geological samples;


    Glass microscope slide


    Glass microscope slides are used to fix thin rock, cement and soil sections;


    Slide cover slide


    Glass cover slides protect valuable thin sections and improve optical sharpness of transmission microscopy;


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