Ultrasonic spraying - Silicon Carbide seed crystal bonding technology

Silicon carbide seed crystal bonding process - SiC - YMUS ultrasonic spraying

Silicon carbide (SiC) is a kind of high-performance ceramic material, with high strength, high hardness, high heat resistance, corrosion resistance and other advantages, so it is widely used in high temperature, high pressure, corrosion and other harsh environment. In some application scenarios, SiC materials need to be bonded with other materials to achieve more complex structural design and mechanical properties, which requires SiC bonding process. In the SiC bonding process, the SIC seed crystal bonding process is the most common and effective method.

I. Basic principle of silicon carbide seed crystal bonding technology

The silicon carbide seed crystal bonding technique is a kind of technology to glue SiC particles by melting them at high temperature.

1. In the heating equipment, place the bonding part of SiC above the seed crystal adhesive, and the seed crystal adhesive is in a high temperature state.

2. The particles of SIC are gradually added to the upper part of the seed crystal adhesive, and the adhesive parts are placed in it.

3. Under high temperature, the particles of SiC react with the adhesive parts of sic, melt and mix, and the adhesive surface becomes a bond surface.

4, ultrasonic spraying equipment to improve the fluidity of the binder and promote the uniform distribution of pressure.

5, through the operation of cooling and heating, so that the adhesive material forms a stable chemical bond, and finally realize the bonding of silicon carbide material.

Ⅱ. The advantages of silicon carbide seed crystal bonding technology

1, high bonding strength: easy to achieve strong bonding, high bonding strength, spanning the interface between different hierarchies, sealing and bonding.

2. Good compatibility of adhesive: silicon carbide and seed crystal adhesive have similarities in chemical properties and crystal structure, therefore, seed crystal adhesive can be better compatible with silicon carbide, while maintaining its function and performance in the long-term application process.

3, low bonding residual: the use of silicon carbide seed crystal bonding technology can achieve the preparation of low residual bond molecules, at the same time in high temperature and corrosion area can better adhere to long-term use.

4, high production efficiency: silicon carbide seed crystal bonding technology makes it possible to prepare SiC in large scale, high precision and fast, which greatly improves the production efficiency.

Ⅲ. Silicon carbide seed crystal bonding technology improvement and adjustment

The SiC seed crystal bonding technique provides an effective method to improve bonding problems between sic and other materials.

1. Increase the thickness of adhesive material appropriately to prevent unstable bonding caused by different melting points of materials.

2, combined with the characteristics of SiC material, adjust the bonding temperature, control the reaction time, to ensure that the production of stable chemical and physical properties of the material.

3, regular process verification and shell quality testing, so as to improve bonding quality and stability.

YMUS Seed-crystal glue spraying machine system is a surface precision ultrasonic spraying equipment integrating ultrasonic atomizer, ultrasonic generator, liquid supply system, motion system, heating system, exhaust system, etc. Ultrasonic spraying is a spraying method based on ultrasonic atomizing nozzle technology. Compared with traditional pneumatic two-fluid spraying, ultrasonic atomizing spraying can bring higher uniformity, thinner coating thickness and higher accuracy. At the same time, because the ultrasonic nozzle does not need air pressure assistance to atomize, the low speed droplets generated by the ultrasonic wave can be easily controlled. The droplets are falling on the substrate, rather than being bumped into the substrate and bouncing from the base, so the ultrasonic spraying can greatly reduce the spray caused by the spraying process, thus greatly reducing the waste of paint. The utilization rate of ultrasonic spraying is more than 4 times that of traditional two-fluid spraying.