Preparation of photoresist in OLED process

Photoresist preparation in OLED process -- Glass coating -- YMUS ultrasonic spraying

Photoresist is produced both for general needs and for specific needs. They adjust for different wavelengths of light and exposure sources. At the same time, the photoresist has specific heat flow characteristics, is configured by a specific method, and is combined with a specific surface. These properties are determined by the type, amount and mixing process of the different chemical components of the photoresist.

Polymer: when exposed in a photolithograph, the polymer structure changes from soluble to polymeric, is a special polymer that is photosensitive and energy sensitive, and is generally composed of a group of large and heavy molecules, including carbon, hydrogen and oxygen, and plastic is a typical polymer.

Solvent: Dilute the photoresist, form a film by spraying coating, the largest component of the photoresist, make the photoresist in liquid state, and enable the photoresist to form a thin layer on the wafer surface by rotating method.

Photosensitive agent: Controls and regulates the chemical reaction of the photoresist during exposure.

Photosensitizer: added to a photoresist to limit the spectral range of the reaction light or to limit the reaction light to a specific wavelength.

Additives: Various added chemical components achieve process effects, different types of additives and photoresist are mixed together to achieve specific results, such as the addition of dye in negative glue to absorb and control light, and the addition of anti-dissolution agents in positive glue.

YMUS ultrasonic spray photoresist is a new kind of photoresist coating technology, which uses high-frequency ultrasonic vibration nozzle to spray liquid photoresist on the substrate. This technology has been widely used in microelectronics, optoelectronics, biomedicine and other fields.

The application of ultrasonic spray photoresist includes the following aspects:

1. Optical device preparation: Ultrasonic spraying photoresist can be used to prepare optical lenses, fiber couplers, optical waveguides and other optical devices. The photoresist coating can achieve high precision and high uniformity, and ensure the excellent optical performance of the device.

2. Preparation of microelectronic devices: Ultrasonic spraying photoresist has a wide range of applications in the preparation of microelectronic devices, such as the preparation of transistors, integrated circuits, sensors, etc. It enables high-resolution, high-precision photoresist coating while reducing damage or contamination caused by contact forces.

3. Biochip preparation: Ultrasonic spraying photoresist can be used to prepare biochips, such as gene chips, protein chips, etc. It can realize high throughput analysis of trace samples and improve the sensitivity and accuracy of biochips.

Compared with traditional coating methods, ultrasonic spray photoresist has the following advantages and advantages:

1. High precision: Ultrasonic spraying can achieve non-contact photoresist coating, avoiding deformation or damage caused by contact force in traditional methods, and ensuring high precision coating

2. High uniformity: Ultrasonic spraying photoresist can achieve uniform spraying, avoiding the uniformity problem caused by the uneven coating head or inconsistent movement speed in the traditional method.

3. Low damage: Ultrasonic spraying photoresist adopts non-contact spraying method to avoid damage or pollution caused by contact force in traditional methods to ensure the integrity of the device surface.